The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Aug. 21, 2020
Mounting substrate to which image sensor is mounted, sensor package and manufacturing method thereof
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Dai Naito, Yokohama, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 23/54 (2023.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); H01L 23/04 (2013.01); H01L 27/146 (2013.01); H05K 1/09 (2013.01); H05K 1/182 (2013.01); H05K 3/0017 (2013.01); H05K 3/181 (2013.01); H05K 2201/032 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted, a frame provided in the mounting substrate so as to surround the image sensor, and a cover attached to the frame so as to cover the image sensor. The mounting substrate includes terminals electrically connected with the image sensor and a groove provided in a predetermined depth between an area in which the frame is provided and the terminals.