The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Oct. 28, 2021
Applicant:
Triple Win Technology(shenzhen) Co.ltd., Shenzhen, CN;
Inventor:
Chia-Weng Hsu, New Taipei, TW;
Assignee:
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/52 (2023.01); G03B 17/55 (2021.01); H04N 23/57 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01);
U.S. Cl.
CPC ...
H04N 23/52 (2023.01); G03B 17/55 (2013.01); H04N 23/57 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01);
Abstract
A circuit board includes a circuit substrate, a first solder mask, and a plurality of heat dissipation fins. The circuit substrate includes a first surface. The first solder mask is arranged on the first surface. The plurality of heat dissipation fins are arranged on a surface of the first solder mask facing away from the first surface. A heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins. A camera assembly having the circuit board and an electronic device having the circuit board are also provided.