The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Dec. 28, 2021
Applicant:

Marvell Asia Pte Ltd., Singapore, SG;

Inventors:

Radhakrishnan L. Nagarajan, Santa Clara, CA (US);

Liang Ding, Singapore, SG;

Mark Patterson, Santa Clara, CA (US);

Roberto Coccioli, Santa Clara, CA (US);

Assignee:

MARVELL ASIA PTE LTD., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04J 14/00 (2006.01); H04J 14/02 (2006.01); G02B 6/293 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H04J 14/02 (2013.01); G02B 6/29352 (2013.01); G02B 6/4246 (2013.01);
Abstract

An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.


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