The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Jun. 08, 2022
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Yosuke Nakata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/00 (2006.01); H01L 23/29 (2006.01); H02M 3/00 (2006.01); H01L 23/31 (2006.01); H02M 7/217 (2006.01); H02M 3/155 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01); H02M 3/003 (2021.05); H01L 23/3142 (2013.01); H02M 3/155 (2013.01); H02M 7/217 (2013.01); H02M 7/5387 (2013.01);
Abstract

A semiconductor device includes: a semiconductor substrate in which a cell region, an isolation region being a region which is located outward of the cell region, and a termination region including a guard ring region being located outward of the isolation region and an excess region being a region which is located outward of the guard ring region are defined; an insulating layer covering a top surface of the semiconductor substrate in the isolation region and the termination region; a surface electrode located on a portion of the top surface of the semiconductor substrate and a portion of a top surface of the insulating layer in the cell region and the isolation region; and a waterproof layer covering a portion of the insulating layer exposed from the surface electrode. The waterproof layer is spaced apart from the surface electrode.


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