The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

May. 22, 2019
Applicant:

Riken, Wako, JP;

Inventors:

Xinzhe Jin, Muroran, JP;

Yoshinori Yanagisawa, Wako, JP;

Renzhong Piao, Wako, JP;

Yu Suetomi, Wako, JP;

Assignee:

RIKEN, Wako, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/02 (2006.01); H01R 4/68 (2006.01); H10N 60/01 (2023.01); H10N 60/85 (2023.01);
U.S. Cl.
CPC ...
H01R 43/02 (2013.01); H01R 4/68 (2013.01); H10N 60/0661 (2023.02); H10N 60/0801 (2023.02); H10N 60/857 (2023.02);
Abstract

Provided is a connection body of high-temperature superconducting wire materials including a first oxide high-temperature superconducting wire material and a second oxide high-temperature superconducting wire material, characterized in that a first superconducting layer of the first oxide high-temperature superconducting wire material and a second superconducting layer of the second oxide high-temperature superconducting wire material are bonded together via a junction including M-Cu—O (wherein M is a single metal element or a plurality of metal elements included in the first superconducting layer or the second superconducting layer). The connection body may be, for example, a connection body of Bi2223 wire materials, and the junction may include CaCuO.


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