The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Oct. 20, 2020
Applicant:

Innoscience (Suzhou) Technology Co., Ltd., Suzhou, CN;

Inventors:

Weixing Du, Suzhou, CN;

Jheng-Sheng You, Suzhou, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01); H01L 29/10 (2006.01); H01L 29/26 (2006.01); H01L 29/15 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7787 (2013.01); H01L 29/1075 (2013.01); H01L 29/157 (2013.01); H01L 29/2003 (2013.01); H01L 29/26 (2013.01); H01L 29/66431 (2013.01); H01L 29/66462 (2013.01); H01L 29/778 (2013.01); H01L 29/7786 (2013.01); H01L 29/7788 (2013.01);
Abstract

A semiconductor device includes a substrate, a first GaN-based high-electron-mobility transistor (HEMT), a second GaN-based HEMT, a first interconnection, and a second interconnection is provided. The substrate has a plurality of first-type doped semiconductor regions and second-type doped semiconductor regions. The first GaN-based HEMT is disposed over the substrate to cover a first region on the first-type doped semiconductor regions and the second-type doped semiconductor regions in the substrate. The second GaN-based HEMT is disposed over the substrate to cover a second region. The first region is different from the second region. The first interconnection is disposed over and electrically connected to the substrate, forming a first interface. The second interconnection is disposed over and electrically connected to the substrate, forming a second interface. The first interface is separated from the second interface by at least two heterojunctions formed in the substrate.


Find Patent Forward Citations

Du, Weixing. (2023). Semiconductor device and method for manufacturing the same (U.S. Patent No. 11777023). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11777023

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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