The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

May. 11, 2022
Applicant:

Semtech Corporation, Camarillo, CA (US);

Inventors:

Liping Ren, Los Angeles, CA (US);

William Allen Russell, Thousand Oaks, CA (US);

Assignee:

Semtech Corporation, Camarillo, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); G05F 3/18 (2006.01); H01L 27/08 (2006.01); H02H 3/20 (2006.01); H02H 9/04 (2006.01); H01L 23/62 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); G05F 3/18 (2013.01); H01L 23/62 (2013.01); H01L 27/02 (2013.01); H01L 27/0814 (2013.01); H02H 3/202 (2013.01); H02H 9/042 (2013.01); H02H 9/046 (2013.01); H02H 9/04 (2013.01);
Abstract

A TVS circuit having a first diode with a cathode coupled to a first terminal and an anode coupled to a first node. A second diode has an anode coupled to a second node and a cathode coupled to a third node. A third diode is coupled between the first node and second node. A fourth diode is coupled between the first node and third node. A fifth diode is coupled between the second node and a second terminal. A sixth diode is coupled between the second terminal and the third node. A seventh diode can be coupled between the second terminal and an intermediate node between the fifth diode and sixth diode. The first diode is disposed on a first semiconductor die, while the second diode is disposed on a second semiconductor die. Alternatively, the first diode and second diode are disposed on a single semiconductor die.


Find Patent Forward Citations

Loading…