The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Mar. 19, 2021
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Yusuke Oba, Tokyo, JP;
Kenichi Yoshida, Tokyo, JP;
Takashi Ohtsuka, Tokyo, JP;
Yuichiro Okuyama, Tokyo, JP;
Tomoya Hanai, Tokyo, JP;
Yu Fukae, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 27/01 (2006.01); H01L 21/70 (2006.01); H01L 21/78 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/707 (2013.01); H01L 21/78 (2013.01); H01L 27/016 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01);
Abstract
Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.