The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Jul. 01, 2021
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Hyun A Lee, Seoul, KR;

Sunok Oh, Hwaseong-si, KR;

Kikyung Youk, Bucheon-si, KR;

Chan-Jae Park, Suwon-si, KR;

Sangduk Lee, Yongin-si, KR;

Soo Yeon Han, Gwacheon-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/00 (2006.01); H10K 77/10 (2023.01); H10K 50/844 (2023.01); H10K 59/131 (2023.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H10K 50/844 (2023.02); H10K 77/111 (2023.02); H01L 24/16 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32112 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/83205 (2013.01); H01L 2224/83908 (2013.01); H01L 2224/9211 (2013.01); H10K 59/131 (2023.02);
Abstract

A display panel having a display region and a non-display region, the display panel includes: a substrate having at least one first opening; an electronic component disposed on the substrate; a plurality of pads disposed in the non-display region and including a first pad and a second pad are spaced apart from each other in a first direction with the at least one first opening therebetween; and an adhesive layer disposed between the substrate and the electronic component and overlapping the at least one first opening.


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