The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Jul. 04, 2018
Applicant:
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Inventor:
Kosuke Ikeda, Saitama, JP;
Assignee:
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/074 (2013.01); H01L 23/16 (2013.01); H01L 23/3107 (2013.01); H01L 24/73 (2013.01); H01L 2224/73263 (2013.01);
Abstract
An electronic module has a first substrate; a first electronic elementprovided on one side of the first substrate; a first connection bodyprovided on the one side of the first electronic element; a second electronic elementprovided on the one side of the first connection body; and a second connection bodyprovided on the one side of the second electronic element. The first electronic elementand the second electronic elementdo not overlap in a plane direction.