The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Jun. 21, 2022
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Yeong-E Chen, Miao-Li County, TW;

Cheng-En Cheng, Miao-Li County, TW;

Yu-Ting Liu, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/768 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/76802 (2013.01); H01L 22/32 (2013.01); H01L 23/5386 (2013.01);
Abstract

A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.


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