The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Jan. 12, 2021
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, KR;
Inventors:
Florian Maxl, Graz, AT;
Markus Pretschuh, Graz, AT;
Maximilian Hofer, Hartberg, AT;
Peter Kurcik, Sankt Nikolai im Sausal, AT;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 23/367 (2006.01); B60L 58/10 (2019.01); B60K 6/28 (2007.10); H01L 23/538 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); B60K 6/28 (2013.01); B60L 58/10 (2019.02); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01); H01L 23/492 (2013.01); H01L 23/4985 (2013.01); H01L 23/5385 (2013.01); H01L 25/0655 (2013.01); B60Y 2200/91 (2013.01); B60Y 2200/92 (2013.01);
Abstract
A power semiconductor device includes: a power semiconductor; a base metal sheet; and a flexible printed circuit board (PCB) between the base metal sheet and the power semiconductor. The power semiconductor includes a first power pad on a side facing the flexible PCB, and the flexible PCB includes a conductive pad, one side of which is electrically connected to the first power pad of the power semiconductor and the opposite side of which is electrically connected to the base metal sheet.