The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Sep. 07, 2021
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Yuning Tsai, Yokohama Kanagawa, JP;

Hidetoshi Kuraya, Yokohama Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49517 (2013.01); H01L 23/49582 (2013.01); H01L 23/3121 (2013.01); H01L 23/49513 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/40175 (2013.01);
Abstract

A semiconductor device according to an embodiment includes a base frame, a semiconductor element provided on the base frame, a connector provided on the semiconductor element, the connector having an upper surface, a side surface, and a porous body having a plurality of pores provided on at least the side surface, and a molded resin provided in a periphery of the semiconductor element and at least the side surface of the connector. The upper surface of the connector is exposed.


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