The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Aug. 13, 2020
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Yutaka Takata, Yokkaichi, JP;

Shintaro Nambara, Yokkaichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 7/282 (2006.01); H01B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01B 7/282 (2013.01); H01B 7/0045 (2013.01);
Abstract

A wire harness including: a first wire bundle that includes a plurality of wires; a second wire bundle that includes fewer wires than the first wire bundle; a splice body; and a waterproofing cover, wherein: the wires of the first wire bundle and the second wire bundle each include a conductor and an insulating covering that covers an outer circumference of the conductor, and each include an exposed portion at which the conductor is exposed from the insulating covering, at the splice body, the exposed portions of the first wire bundle and the exposed portions of the second wire bundle are bonded, and the waterproofing cover integrally covers the splice body, the outer surfaces of the insulating coverings of the first wire bundle, and the outer surfaces of the insulating covering of the second wire bundle with a resin material.


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