The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Apr. 12, 2021
Beijing Dream Ink Technologies Co., Ltd., Beijing, CN;
Shijin Dong, Beijing, CN;
Zhenlong Men, Beijing, CN;
Beijing Dream Ink Technologies Co., Ltd., Beijing, CN;
Abstract
A flexible conductive paste and a flexible electronic device are provided, which relate to the technical field of new materials. The flexible conductive paste includes: 3% to 7% by weight of a film former; 20% to 50% by weight of a conductive powder; 25% to 45% by weight of a liquid metal microcapsule; 10% to 30% by weight of a solvent; 0.1% to 5% by weight of a curing agent; and 0.5% to 5% by weight of a functional additive. The wall of the liquid metal microcapsule is a coating resin, the core of the liquid metal microcapsule is a liquid metal. The melting point Tm of the liquid metal satisfies Tm≤T1. The film former has a molecular weight within a range of 15000 to 30000, and has a glass transition temperature Tg smaller than or equal to T1. T1 is a temperature at which the flexible conductive circuit manufactured by the flexible conductive paste is deformed. The flexible conductive circuit of the present disclosure can have better conductivity and better flexibility simultaneously.