The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Dec. 21, 2018
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Brett A. Beiermann, St. Paul, MN (US);

John C. Clark, Maplewood, MN (US);

Eric G. Larson, Lake Elmo, MN (US);

Jeremy M. Higgins, Roseville, MN (US);

Audrey S. Forticaux, Minneapolis, MN (US);

Jay R. Lomeda, St. Paul, MN (US);

Wayne S. Mahoney, St. Paul, MN (US);

Scott B. Charles, Spring Valley, WI (US);

Timothy D. Fletcher, Lino Lakes, MN (US);

Wendy L. Thompson, Roseville, MN (US);

Kyle R. Schwartz, Maplewood, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08K 3/14 (2006.01); C08K 3/22 (2006.01); C08K 3/38 (2006.01); C08K 7/20 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08K 3/14 (2013.01); C08K 3/22 (2013.01); C08K 3/38 (2013.01); C08K 7/20 (2013.01); H05K 5/02 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/009 (2013.01);
Abstract

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.


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