The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Jul. 08, 2022
Applicant:

Agc Automotive Americas Co., Alpharetta, GA (US);

Inventors:

Jiangping Wang, Novi, MI (US);

Joel Smith, Battle Creek, MI (US);

Timothy D. Peck, White Lake, MI (US);

Frederick Maurice Schaible, III, Ann Arbor, MI (US);

Abdelhalim Mohamed, Canton, MI (US);

Christopher A. Imeson, Lasalle, CA;

Assignee:

AGC Automotive Americas Co., Alpharetta, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 17/00 (2006.01); B32B 17/10 (2006.01); B32B 38/00 (2006.01); B32B 37/24 (2006.01); C03C 17/28 (2006.01);
U.S. Cl.
CPC ...
C03C 17/001 (2013.01); B32B 17/10036 (2013.01); B32B 17/10385 (2013.01); B32B 17/10935 (2013.01); B32B 37/24 (2013.01); B32B 38/145 (2013.01); C03C 17/28 (2013.01); B32B 2037/243 (2013.01); B32B 2250/03 (2013.01); B32B 2255/24 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); B32B 2310/0831 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01); B32B 2605/006 (2013.01); B32B 2605/08 (2013.01); C03C 2217/70 (2013.01); C03C 2218/119 (2013.01); C03C 2218/32 (2013.01);
Abstract

A method of manufacturing a glass assembly to have a conductive feature includes a step of forming a glass substrate that is curved. The method also includes digitally-applying a conductive ink without a mask onto a surface of the curved glass substrate. The method further includes curing the conductive ink to form the conductive feature on the surface of the curved glass substrate, with the conductive feature having a resolution of greater than 200 dots per inch.


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