The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Aug. 31, 2022
Applicant:

Rolls-royce Deutschland Ltd & CO KG, Blankenfelde-Mahlow, DE;

Inventors:

Uwe Waltrich, Forchheim, DE;

Stanley Buchert, Herzogenaurach, DE;

Assignee:

Rolls-Royce Deutschland Ltd & Co KG, Blankenfelde-Mahlow, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64C 29/00 (2006.01); H05K 7/20 (2006.01); H02M 7/537 (2006.01); H05K 7/14 (2006.01); H02M 7/00 (2006.01); B64D 35/04 (2006.01); B64D 27/10 (2006.01); B60L 15/02 (2006.01); B64D 27/24 (2006.01); B64D 27/02 (2006.01);
U.S. Cl.
CPC ...
B64C 29/0033 (2013.01); B60L 15/02 (2013.01); B64D 27/10 (2013.01); B64D 27/24 (2013.01); B64D 35/04 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H05K 7/1427 (2013.01); H05K 7/209 (2013.01); B60L 2200/10 (2013.01); B60L 2210/30 (2013.01); B64D 2027/026 (2013.01);
Abstract

An electrical vertical takeoff and landing (eVTOL) aircraft includes an electrical propulsion unit that has a propeller or a fan configured to be driven to rotate by an electric motor arranged to receive electrical power from an inverter. The inverter includes a carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element. Each power semiconductor switching element is comprised in a power semiconductor prepackage. A heat sink is arranged to remove heat from the respective power semiconductor prepackage. The heat sink is spaced apart from the carrier substrate to define a heat sink gap between the carrier substrate and the heat sink. A converter parameter φ, which is defined as a size of the heat sink gap divided by a maximum electric field strength in the heat sink gap, is less than or equal to 20 nm/V.


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