The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

May. 25, 2020
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Yasuhiro Yoshikawa, Kyoto, JP;

Toshihiro Kimura, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01); B41J 2/345 (2006.01);
U.S. Cl.
CPC ...
B41J 2/345 (2013.01); B41J 2/335 (2013.01); B41J 2/3355 (2013.01); B41J 2/33535 (2013.01);
Abstract

A thermal print head includes a heat-generating substrate, a resistor layer, a conductive layer, a first substrate, a second substrate, and a third substrate. The heat-generating substrate includes a heat-generating substrate obverse face and a heat-generating substrate reverse face that are spaced apart from each other in a thickness direction. The resistor layer is supported by the heat-generating substrate. The conductive layer is supported by the heat-generating substrate, and electrically connected to the resistor layer. The first substrate is located upstream of the heat-generating substrate in a sub-scanning direction. The second substrate is located upstream of the first substrate in the sub-scanning direction. The third substrate is bonded to the first substrate and the second substrate and higher in flexibility than the first substrate.


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