The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Mar. 04, 2020
Applicant:
Teijin Limited, Osaka, JP;
Inventors:
Yoshitaka Tanaka, Gifu, JP;
Koji Kubo, Osaka, JP;
Assignee:
TEIJIN LIMITED, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B29C 45/14 (2006.01); B29C 51/10 (2006.01); B29C 51/14 (2006.01); B29C 65/44 (2006.01); B29C 65/00 (2006.01); B32B 7/12 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B29C 45/14811 (2013.01); B29C 51/10 (2013.01); B29C 51/14 (2013.01); B29C 65/44 (2013.01); B29C 66/723 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/74283 (2013.01); B32B 7/12 (2013.01); B32B 27/20 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2264/1021 (2020.08); B32B 2307/402 (2013.01); B32B 2307/406 (2013.01); B32B 2307/518 (2013.01); B32B 2307/538 (2013.01); B32B 2307/584 (2013.01); B32B 2307/714 (2013.01); B32B 2307/732 (2013.01);
Abstract
A laminated body in which a thermoplastic resin layer, a thermosetting resin layer, and a protective film are layered one on another in this order, in which the thermosetting resin layer contains a thermosetting resin composition containing two or more kinds of organometallic complex, a surface of the protective film at an opposite side of the thermosetting resin layer has a surface roughness Ra of 30 nm or less, and an amount of nitrogen atoms present at the surface of the protective film at the side of the thermosetting resin layer is less than 1 atm %.