The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

May. 12, 2020
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

John Bowler, Phoenix, AZ (US);

Gregory Colvin, Phoenix, AZ (US);

Suresh Sundarraj, Mesa, AZ (US);

Assignee:

HONEYWELL INTERNATIONAL INC., Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/245 (2017.01); B29C 64/273 (2017.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/245 (2017.08); B29C 64/273 (2017.08);
Abstract

Prior to manufacturing a product by additive manufacturing, a stress relief profile including frequency and amplitude parameters of an ultrasonic input is determined based on physical properties of the product, including resonant frequencies of the product and a material from which the product is manufactured. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. A processor accesses stress relief profile parameters for each layer, determines whether a layer requires stress relief and determines a frequency and a power level for the stress relief at the layer. An ultrasonic input is applied with the determined parameters to relieve stress as the product is built up.


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