The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Dec. 14, 2018
Applicants:

Carnegie Mellon University, Pittsburgh, PA (US);

Nanyang Technological University, Singapore, SG;

Inventors:

Kuen Jimmy Hsia, Pittsburgh, PA (US);

Changjin Huang, Pittsburgh, PA (US);

Subra Suresh, Singapore, SG;

Assignees:

CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US);

NANYANG TECHNOLOGICAL UNIVERSITY, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/124 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B29C 64/25 (2017.01); C08F 2/04 (2006.01); C08F 20/06 (2006.01); C08F 220/56 (2006.01); C08F 222/02 (2006.01); C08K 3/30 (2006.01); C08K 5/17 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/124 (2017.08); B29C 64/25 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C08F 2/04 (2013.01); C08F 20/06 (2013.01); C08F 220/56 (2013.01); C08F 222/02 (2013.01); C08K 3/30 (2013.01); C08K 5/17 (2013.01); B29K 2105/0061 (2013.01); C08K 2003/3054 (2013.01);
Abstract

There is provided a method of forming a 3-dimensional structure from a hydrogel, the process comprising the steps of: (a) placing a hydrogel polymerisation solution into a reaction vessel, and (b) allowing the hydrogel polymerisation solution to react without mixing for a period of time at ambient temperature, while introducing a polymerisation modulator to the reaction solution through a reaction solution/polymerisation modulator interface, wherein over the period of time, a modulation effect gradient is established in the reaction solution, where the modulation effect has a maximal value at the reaction solution/polymerisation modulator interface and a minimal value at a point furthest away from said interface. The said method additionally includes the use of physical constraint members such as wires and/or threads.


Find Patent Forward Citations

Hsia, Kuen. (2023). Directed polymerization method to generate complex, three dimensional (3d) structures in soft materials (U.S. Patent No. 11772323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11772323

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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