The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Apr. 16, 2019
SK Enpulse Co., Ltd., Gyeonggi-do, KR;
Hye Young Heo, Gyeonggi-do, KR;
Jang Won Seo, Busan, KR;
Jong Wook Yun, Gyeonggi-do, KR;
Sunghoon Yun, Gyeonggi-do, KR;
Jaein Ahn, Gyeonggi-do, KR;
SK enpulse Co., Ltd., Gyeonggi-do, KR;
Abstract
Embodiments relate to a porous polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polishing pad can be adjusted in light of the volume thereof. Thus, the plurality of pores have an apparent volume-weighted average pore diameter in a specific range, thereby providing a porous polishing pad that is excellent in such physical properties as polishing rate and the like.