The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Jul. 12, 2022
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Seongchan Pack, West Bloomfield Township, MI (US);

Anthony Michael Coppola, Rochester Hills, MI (US);

James R. Salvador, East Lansing, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0081 (2013.01);
Abstract

An electromagnetic interference shielding composite. The electromagnetic interference shielding composite includes a polymer substrate formed into a shape of a packaging component. The composite further includes an electromagnetic interference layer contacting the polymer substrate and a conductive coating contacting the electromagnetic interference layer. An integrated power electronic module includes packaging including the electromagnetic interference shielding composite. A method of forming the electromagnetic interference shielding composite for an integrated power electronic module includes molding a polymer substrate into a shape of a packaging component, forming an electromagnetic interference layer on the polymer substrate, and forming a conductive coating on the electromagnetic interference layer.


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