The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Dec. 08, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Youngsun Lee, Suwon-si, KR;

Sungwon Park, Suwon-si, KR;

Sunghyup Lee, Suwon-si, KR;

Byeonguk Min, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/148 (2013.01); H05K 1/036 (2013.01); H05K 1/11 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A printed circuit board and an electronic device including the printed circuit board are provided. The electronic device includes a housing, and a printed circuit board located in an inner space of the housing, wherein the printed circuit board includes a component disposition area in which at least one component is disposed, a pre-forming area in which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and a flexible area having flexible characteristics and on which the plastic deformation material is not laminated.


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