The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Feb. 24, 2017
Applicant:
Newsouth Innovations Pty Limited, Sydney, AU;
Inventors:
Alison Joan Lennon, Rozelle, AU;
Vincent Akira Allen, Balgownie, AU;
Assignee:
NewSouth Innovations Pty Limited, New South Wales, AU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/0216 (2014.01); H01L 31/0224 (2006.01); H01L 31/0236 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1888 (2013.01); H01L 31/02168 (2013.01); H01L 31/02366 (2013.01); H01L 31/022475 (2013.01); H01L 31/1884 (2013.01); Y02E 10/50 (2013.01);
Abstract
The present disclosure provides a method for treating a surface portion of a TCO material in a semiconductor device that comprises a structure arranged to facilitate current flow in one direction. To perform the method the surface portion of the TCO is exposed to an electrolyte and a current is induced in the device. The current allows reducing the TCO material in a manner such that the adhesion of a metallic material to the exposed surface portion is improved over the adhesion of the metallic material to a non-exposed surface portion.