The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Oct. 14, 2021
Applicant:
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Rui Huang, Beijing, CN;
Haibin Zhu, Beijing, CN;
Assignee:
BOE Technology Group Co., Ltd., Beijing, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/105 (2006.01); H01L 31/02 (2006.01); H01L 31/0224 (2006.01); H01L 31/20 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1055 (2013.01); H01L 31/02005 (2013.01); H01L 31/022408 (2013.01); H01L 31/202 (2013.01);
Abstract
An optoelectronic integrated substrate, a preparation method thereof and an optoelectronic integrated circuit. The electronic integrated substrate includes a base substrate and an electronic device and a photo-diode disposed on the base substrate, wherein the photo-diode includes an ohmic contact layer and an intrinsic amorphous silicon layer, and the ohmic contact layer and the intrinsic amorphous silicon layer are sequentially arranged along a direction parallel to the plane of the base substrate and are connected.