The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Dec. 28, 2021
Applicant:
Nanosys, Inc., Milpitas, CA (US);
Inventor:
Brian Kim, Santa Clara, CA (US);
Assignee:
NANOSYS, INC., Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 27/12 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/58 (2010.01); H10K 50/86 (2023.01); H10K 59/00 (2023.01); H10K 59/12 (2023.01); H01L 25/16 (2023.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 27/1214 (2013.01); H01L 33/483 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H10K 50/865 (2023.02); H10K 59/00 (2023.02); H10K 59/12 (2023.02); H01L 25/167 (2013.01); H01L 33/405 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, a transparent conductive layer contacting front side surfaces of the light emitting diodes, an optical bonding layer located over a front side surface of the transparent conductive layer, a transparent cover plate located over a front side surface of the optical bonding layer, and a black matrix layer including an array of openings therethrough, and located between the optical bonding layer and the transparent cover plate.