The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Dec. 04, 2017
Applicant:
Thermavant Technologies, Llc, Columbia, MO (US);
Inventors:
Christopher D. Smoot, Columbia, MO (US);
Joe Boswell, San Francisco, CA (US);
Corey Wilson, Jefferson City, MO (US);
Assignee:
THERMAVANT TECHNOLOGIES, LLC, Columbia, MO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); F28D 15/04 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); F28D 15/04 (2013.01); H01L 21/4871 (2013.01);
Abstract
A miniaturized oscillating heat pipe (OHP) embedded within an integrated circuit (IC) is provided. The miniaturized oscillating heat pipe (OHP) integrally formed within an integrated circuit (IC) is fabricated to form a monolithic IC device using silicon (or similar future semiconductors) fabrication techniques. The OHP is operable to transfer high local heat fluxes within the IC device to more accessible locations on the IC device for heat rejection to an available heat sink.