The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Sep. 29, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Keiichi Ishida, Nagaokakyo, JP;

Koichi Ida, Nagaokakyo, JP;

Hideaki Ooi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/24 (2006.01); H01F 41/02 (2006.01); H01F 27/255 (2006.01); H01F 1/26 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 1/24 (2013.01); H01F 1/26 (2013.01); H01F 17/04 (2013.01); H01F 27/255 (2013.01); H01F 41/0246 (2013.01); H01F 2017/048 (2013.01);
Abstract

A coil component that can maintain a high magnetic permeability and improve a DC superposition characteristic, and a method for producing a magnetic powder-containing resin material used to provide such a coil component. A coil component according includes an element body including a coil conductor and a magnetic portion. The coil conductor is formed of a wound conductor wire. The magnetic portion containing metal magnetic material grains covered with an insulating coating, a resin, and insulator grains. The coil component further includes an external electrode electrically connected to an extended portion of the coil conductor and disposed on a surface of the element body. The insulator grains have a relative permeability lower than a relative permeability of the metal magnetic material grains, and the insulator grains and the insulating coating are a compound whose main component is the same.


Find Patent Forward Citations

Loading…