The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Jan. 18, 2022
Smart Radar System, Inc., Seongnam-si, KR;
Jae Yong Lee, Anyang-si, KR;
Yeon Hee Song, Seoul, KR;
SMART RADAR SYSTEM, INC., Seongnam-si, KR;
Abstract
Provided is a method of measuring eccentricity of a blind via hole formed in a printed circuit board including an inner-layer board and an outer-layer board that are bonded by thermocompression bonding. The method includes acquiring, by a microscope camera, an image by photographing a marker which is formed on a surface of the outer-layer board and a blind via hole which is exposed upward through a marker hole formed in a center of the marker with a microscope camera, and measuring, by computing equipment connected to the microscope camera, eccentricity indicating a separation distance and a separation direction from central coordinates of the marker hole to central coordinates of the blind via hole using a distance between an end point of the marker hole and an end point of the blind via hole which are included in the image.