The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Jun. 24, 2022
Applicant:
Aeva, Inc., Mountain View, CA (US);
Inventors:
Zhizhong Tang, San Carlos, CA (US);
Pradeep Srinivasan, Fremont, CA (US);
Bing Shen, Sunnyvale, CA (US);
Assignee:
Aeva, Inc., Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 7/481 (2006.01); H01L 25/16 (2023.01); G01S 7/4863 (2020.01); G01S 17/32 (2020.01); G01S 17/89 (2020.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
G01S 7/4863 (2013.01); G01S 7/4814 (2013.01); G01S 7/4816 (2013.01); G01S 17/32 (2013.01); G01S 17/89 (2013.01); H01L 21/60 (2021.08); H01L 25/167 (2013.01);
Abstract
A light detection and ranging (LIDAR) system and apparatus including a photonics chip mounted to a substrate, the photonics chip including one or more optical components and one or more electrical components and one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and the one or more electrical components, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.