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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11767614 B1

PDFFull Text
Date of Patent:
Sep. 26, 2023

Filed:

Dec. 09, 2020

Preparation method of chitin-modified polypropylene spunbond non-woven fabric

Applicants:

Sinotech Academy of Textile (Qingdao) Co., Ltd., Qingdao, CN;

Bestee Material (Tsingtao) Co., Ltd., Qingdao, CN;

Inventors:

Xiaohua Huang, Qingdao, CN;

Yanming Liu, Qingdao, CN;

Xiaoqian Huang, Qingdao, CN;

Assignees:

SINOTECH ACADEMY OF TEXTILE (QINGDAO) CO., LTD., Qingdao, CN;

BESTEE MATERIAL (TSINGTAO) CO., LTD., Qingdao, CN;

Attorney:

ANOVA LAW GROUP, PLLC

Primary Examiner:

Leo B Tentoni

Int. Cl.
CPC ...
C08L 5/08 (2006.01); D01D 1/04 (2006.01); D01D 5/088 (2006.01); D01F 1/02 (2006.01); D01F 1/10 (2006.01); D01F 6/06 (2006.01); D04H 3/007 (2012.01); D04H 3/045 (2012.01); D06C 7/00 (2006.01); D06C 15/00 (2006.01); C08L 23/12 (2006.01); D01F 6/46 (2006.01); D04H 1/4291 (2012.01); C08J 3/20 (2006.01); C08B 37/08 (2006.01);
U.S. Cl.
CPC ...
D01F 1/103 (2013.01); C08B 37/003 (2013.01); C08J 3/203 (2013.01); C08L 23/12 (2013.01); D01F 6/46 (2013.01); D04H 1/4291 (2013.01); C08L 2203/12 (2013.01); C08L 2205/035 (2013.01); C08L 2205/06 (2013.01); D10B 2321/022 (2013.01);
Abstract

A chitin-modified polypropylene spunbond non-woven fabric and a preparation method of the chitin-modified polypropylene spunbond non-woven fabric are provided. The chitin-modified polypropylene spunbond non-woven fabric contains a modified chitin in a weight percentage range of approximately 0.2%-1.5%. The modified chitin includes chitin modified by a modifier including 2-hydroxybenzimidazole, cellulose acetate butyrate, and adipic acid dihydrazide. The chitin-modified polypropylene spunbond non-woven fabric has an anti-mold grade less than 1, and an antibacterial rate greater than 9.5%.

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