The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Oct. 01, 2020
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Shinji Onda, Ichihara, JP;

Kunihiro Morinaga, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/32 (2006.01); C08L 63/00 (2006.01); C08J 5/24 (2006.01); B32B 15/092 (2006.01); B32B 27/38 (2006.01); H01L 23/29 (2006.01); C08L 61/12 (2006.01); C08G 59/06 (2006.01); C08G 59/62 (2006.01);
U.S. Cl.
CPC ...
C08L 61/12 (2013.01); C08G 59/06 (2013.01); C08J 5/24 (2013.01); C08J 2361/12 (2013.01); C08L 2203/20 (2013.01);
Abstract

The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.


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