The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Oct. 07, 2019
Applicant:
Toyobo Co., Ltd., Osaka, JP;
Inventors:
Gota Takimoto, Shiga, JP;
Michihiko Irie, Shiga, JP;
Assignee:
TOYOBO CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/50 (2006.01); C09J 163/00 (2006.01); C08L 63/00 (2006.01); C08K 3/01 (2018.01); C08K 7/18 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/40 (2006.01); C08K 3/22 (2006.01); C08K 3/38 (2006.01); C08K 5/353 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C08G 59/3227 (2013.01); C08G 59/4021 (2013.01); C08K 3/22 (2013.01); C08K 3/38 (2013.01); C08K 5/353 (2013.01); C08K 7/18 (2013.01); C09J 163/00 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C09J 2203/326 (2013.01);
Abstract
The present invention aims to provide a resin composition which can form a cured product having a high adhesive property and a high thermal conductivity. A resin composition containing an epoxy compound (A), an amine curing agent (B) and a thermally conductive filler (C), wherein the epoxy compound (A) is in a liquid form and wherein the amine curing agent (B) contains a benzoxazole skeleton.