The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Feb. 27, 2020
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventor:
Keisuke Kimura, Nagoya, JP;
Assignee:
NGK INSULATORS, LTD., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 46/24 (2006.01); C04B 38/00 (2006.01); C04B 35/565 (2006.01); B01D 39/20 (2006.01); C04B 26/28 (2006.01);
U.S. Cl.
CPC ...
C04B 38/0019 (2013.01); B01D 39/2068 (2013.01); B01D 46/2418 (2013.01); B01D 46/2425 (2013.01); B01D 46/2448 (2013.01); B01D 46/2478 (2021.08); B01D 46/24491 (2021.08); B01D 46/24494 (2021.08); B01D 46/24495 (2021.08); C04B 26/285 (2013.01); C04B 35/565 (2013.01); C04B 2235/3826 (2013.01);
Abstract
A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 μm.