The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Aug. 17, 2018
Showa Denko Packaging Co., Ltd., Kanagawa, JP;
SHOWA DENKO PACKAGING CO., LTD., Kanagawa, JP;
Abstract
Provided is a molding packaging material which is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layeras an outer layer, a heat fusible resin layeras an inner layer, and a metal foil layerarranged between the two layers. The heat fusible resin layeris composed of a single layer or a multi-layer. The innermost layer of the heat fusible resin layeris made of a resin composition containing a heat fusible resin, an anti-blocking agent, a slip agent, and a fluoropolymer-based lubricant.