The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Aug. 30, 2021
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

James R. Kendall, Mt. Pleasant, SC (US);

Raviendra S. Suriyaarachchi, Kirkland, WA (US);

Andrew E. Modin, Charleston, SC (US);

Assignee:

The Boeing Company, Arlington, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/34 (2006.01); B29C 70/54 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 70/345 (2013.01); B29C 70/54 (2013.01); B29L 2031/3082 (2013.01);
Abstract

There is provided a forming apparatus for forming a high contour composite structure. The forming apparatus includes an upper die and a lower die between which a composite charge is formed. The forming apparatus further includes a plurality of load cells, a control system, and an overlay tool assembly coupled to the upper die. The overlay tool assembly has scalloped sections positioned between pairs of the plurality of load cells, and positioned against portion(s) of the composite charge. The composite charge has ply discontinuity features through the one or more portions. The overlay tool assembly denies pressure and a through thickness compaction to the one or more portions of the composite charge during a forming process, to allow one or more plies in the one or more portions to move after the forming process, and to enable in-plane bending of the high contour composite structure in post-forming operations.


Find Patent Forward Citations

Loading…