The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Feb. 28, 2020
Applicant:

Omron Corporation, Kyoto, JP;

Inventor:

Daniel P. Norboe, Alameda, CA (US);

Assignee:

OMRON CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 19/00 (2006.01); B25J 9/04 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
B25J 19/0054 (2013.01); B25J 9/042 (2013.01); H05K 7/20409 (2013.01);
Abstract

This application describes multi-path cooling arrangements for robotic systems. For example, a robotic system can include a heat generating component positioned within a base that supports one or more articulating links. The heat generating component can be supported on a thermally conductive bracket within the base. The robotic system can include a first thermally conductive path configured to dissipate heat from the heat generating component. The first thermally conductive path can include the bracket and a first heatsink connected to the bracket. The robotic system can also include a second thermally conductive path configured to dissipate heat from the heat generating component. The second thermally conductive path can include the bracket, a thermal pad positioned on the bracket, and a second heatsink positioned on a second side of the base.


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