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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11766759 B1

PDFFull Text
Date of Patent:
Sep. 26, 2023

Filed:

Apr. 19, 2019

Porous polyurethane polishing pad and process for producing the same

Applicant:

SK Enpulse Co., Ltd., Gyeonggi-do, KR;

Inventors:

Hye Young Heo, Gyeonggi-do, KR;

Jang Won Seo, Busan, KR;

Jong Wook Yun, Gyeonggi-do, KR;

Sunghoon Yun, Gyeonggi-do, KR;

Jaein Ahn, Gyeonggi-do, KR;

Assignee:

SK enpulse Co., Ltd., Gyeonggi-do, KR;

Attorney:

IP & T GROUP LLP

Primary Examiner:

Melissa A Rioja

Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24B 37/26 (2012.01); B24D 18/00 (2006.01); B29C 39/00 (2006.01); B29C 39/02 (2006.01); C08G 18/08 (2006.01); C08G 18/10 (2006.01); C08G 18/32 (2006.01); C08G 18/76 (2006.01); C08J 5/18 (2006.01); C08J 9/00 (2006.01); C08J 9/04 (2006.01); C08J 9/12 (2006.01); C08J 9/236 (2006.01); C08J 9/32 (2006.01); C08L 75/04 (2006.01); C09D 175/04 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); C08J 9/32 (2013.01); C08G 18/10 (2013.01); C08G 18/14 (2013.01); C08J 2375/04 (2013.01); H01L 21/3212 (2013.01);
Abstract

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polyurethane polishing pad can be adjusted. Thus, it is possible to provide a porous polyurethane polishing pad that has enhanced physical properties such as a proper level of withstand voltage, excellent polishing performance (i.e., polishing rate), and the like.

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