The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Apr. 20, 2022
Applicant:

Illinois Tool Works Inc., Glenview, IL (US);

Inventors:

William A. Losiewicz, Douglas, MA (US);

Matthew F. Schumacher, Edina, MN (US);

Bruce C. Seaton, Essex, GB;

Kenneth J. King, East Freetown, MA (US);

Assignee:

Illinois Tool Works Inc., Glenview, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0638 (2013.01); B23K 3/08 (2013.01);
Abstract

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.


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