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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11765840 B1

PDFFull Text
Date of Patent:
Sep. 19, 2023

Filed:

Dec. 03, 2018

Copper foil with carrier

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Rintaro Ishii, Ageo, JP;

Takenori Yanai, Ageo, JP;

Yoshinori Matsuura, Ageo, JP;

Assignee:

MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Michael E La Villa

Int. Cl.
CPC ...
H05K 3/46 (2006.01); H01B 5/14 (2006.01); B32B 15/01 (2006.01); C23C 30/00 (2006.01); C23C 14/00 (2006.01); B32B 15/04 (2006.01); C23C 14/02 (2006.01); C23C 14/18 (2006.01); H05K 1/09 (2006.01); B32B 7/06 (2019.01); B32B 17/06 (2006.01); B32B 15/20 (2006.01); B32B 18/00 (2006.01); C23C 28/00 (2006.01); C23C 14/06 (2006.01); C23C 14/08 (2006.01); B32B 7/04 (2019.01);
U.S. Cl.
CPC ...
H05K 3/4682 (2013.01); B32B 7/04 (2013.01); B32B 7/06 (2013.01); B32B 15/01 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); B32B 17/06 (2013.01); B32B 18/00 (2013.01); C23C 14/024 (2013.01); C23C 14/025 (2013.01); C23C 14/06 (2013.01); C23C 14/08 (2013.01); C23C 14/085 (2013.01); C23C 14/086 (2013.01); C23C 14/087 (2013.01); C23C 14/185 (2013.01); C23C 28/00 (2013.01); C23C 28/30 (2013.01); C23C 28/321 (2013.01); C23C 28/34 (2013.01); C23C 28/341 (2013.01); C23C 28/343 (2013.01); C23C 28/345 (2013.01); C23C 28/3455 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H01B 5/14 (2013.01); H05K 1/09 (2013.01); H05K 3/467 (2013.01); B32B 2311/12 (2013.01); C23C 14/0605 (2013.01); C23C 14/081 (2013.01); C23C 14/083 (2013.01); C23C 14/18 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/016 (2013.01); H05K 2203/088 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12188 (2015.01); Y10T 428/12229 (2015.01); Y10T 428/12451 (2015.01); Y10T 428/12597 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12618 (2015.01); Y10T 428/12625 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12924 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/265 (2015.01);
Abstract

An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.

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