The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Oct. 10, 2018
Applicant:
Schlumberger Technology Corporation, Sugar Land, TX (US);
Inventors:
Steven O. Dunford, Missouri City, TX (US);
Mark Kostinovsky, Houston, TX (US);
Lweness Mazari, Sugar Land, TX (US);
Assignee:
SCHLUMBERGER TECHNOLOGY CORPORATION, Sugar Land, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/34 (2006.01); H05K 3/12 (2006.01); H05K 1/16 (2006.01); H01F 41/16 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4664 (2013.01); H05K 3/1283 (2013.01); H05K 3/341 (2013.01); H01F 41/041 (2013.01); H01F 41/16 (2013.01); H05K 1/165 (2013.01); H05K 3/1241 (2013.01); H05K 3/4667 (2013.01); H05K 2203/1484 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49073 (2015.01);
Abstract
A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.