The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Sep. 25, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Mitsutoshi Hasegawa, Yokohama, JP;

Kunihiko Minegishi, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/113 (2013.01); H05K 3/3436 (2013.01); H05K 3/3452 (2013.01); H05K 3/3485 (2020.08); H05K 3/4007 (2013.01); H05K 2201/099 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A printed circuit board includes an electronic component including a first land, a printed wiring board including a resist portion and a second land, and a connecting portion interconnecting the first land and the second land. An opening larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion protruding from the body portion, the body portion being disposed further on an inside than an outer edge of the first land, and at least part of the protruding portion protruding further to an outside than the first land.


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