The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Dec. 25, 2020
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Lianbin Liu, Beijing, CN;

Hengzhen Liang, Beijing, CN;

Xu Lu, Beijing, CN;

Xiaolong Zhu, Beijing, CN;

Qing Gong, Beijing, CN;

Hui Wen, Beijing, CN;

Ting Qin, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); G01L 9/08 (2006.01); G01L 9/02 (2006.01); G01L 9/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); G01L 9/02 (2013.01); G01L 9/08 (2013.01); G01L 9/12 (2013.01); H05K 1/028 (2013.01); H05K 1/0218 (2013.01); H05K 1/0346 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A flexible printed circuit and a display device are provided. The flexible printed circuit includes: a plurality of sub-circuit boards arranged in a stack, wherein the plurality of sub-circuit boards include at least a first sub-circuit board and a second sub-circuit board; and a pressure sensor arranged on the first sub-circuit board, wherein the first sub-circuit board includes: a substrate film; a conductive film arranged on a side of the substrate film away from the second sub-circuit board; an adhesive layer arranged on a side of the conductive film away from the substrate film; a cover layer arranged on a side of the adhesive layer away from the substrate film; and an electromagnetic shielding layer arranged on a side of the cover layer away from the substrate film, wherein at least a part of the conductive film is formed as an electrode of the pressure sensor.


Find Patent Forward Citations

Loading…