The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Jun. 24, 2021
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Norimichi Noguchi, Osaka, JP;

Masateru Mikami, Hyogo, JP;

Kenji Toyoshima, Fukui, JP;

Hiroki Oda, Fukui, JP;

Daisuke Suetsugu, Osaka, JP;

Tatsuya Urakawa, Fukui, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01C 1/14 (2006.01); H01C 7/18 (2006.01); H01C 17/00 (2006.01); H05K 1/16 (2006.01); C04B 35/624 (2006.01); C04B 35/44 (2006.01); B32B 18/00 (2006.01); C04B 35/08 (2006.01); C04B 35/584 (2006.01); C04B 35/581 (2006.01); C04B 35/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); B32B 18/00 (2013.01); C04B 35/44 (2013.01); C04B 35/624 (2013.01); H01C 1/14 (2013.01); H01C 7/18 (2013.01); H01C 17/006 (2013.01); H05K 1/167 (2013.01); C04B 35/04 (2013.01); C04B 35/08 (2013.01); C04B 35/581 (2013.01); C04B 35/584 (2013.01);
Abstract

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.


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