The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Aug. 11, 2021
Applicant:

Intops Co., Ltd., Anyang-si, KR;

Inventors:

Sung-hoon Jung, Anyang-si, KR;

Tae yong Hong, Anyang-si, KR;

Assignee:

INTOPS CO., LTD., Anyang-si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); H05K 3/0064 (2013.01); H05K 3/18 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01);
Abstract

Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.


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