The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

May. 19, 2022
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Yutaka Takeuchi, Tokyo, JP;

Hideyuki Takahama, Tokyo, JP;

Yuzo Taguchi, Tokyo, JP;

Shozo Kanzaki, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0275 (2013.01); H05K 1/112 (2013.01); H05K 1/186 (2013.01); H05K 3/0005 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09509 (2013.01);
Abstract

An object here is to provide a control device which can be reduced in size, weight and cost while being able to prevent unauthorized access. The control device includes: a microcontroller having a storage device, a processor, a package in which the storage device and the processor are accommodated, and multiple communication electrodes provided on a bottom surface of the package; and a wiring board having wiring layers comprised of a front surface layer, an intermediate layer and a rear surface layer, each having a wiring pattern formed therein, insulating members for insulating the respective wiring layers from each other; interlayer connection portions each making an electrical connection between the wiring patterns in different ones of the wiring layers; multiple electrode pads formed n the front surface layer; and communication-dedicated interlayer connection portions which are electrically connected to the respective electrode pads, and which are each externally exposed.


Find Patent Forward Citations

Loading…