The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Sep. 28, 2020
Applicant:

Lite-on Singapore Pte. Ltd., Singapore, SG;

Inventors:

Guang-Li Song, Singapore, SG;

Suresh Basoor Nijaguna, Singapore, SG;

Qian Pang, Jiamusi, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H04R 31/00 (2006.01); H04R 25/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H04R 25/603 (2019.05); B81C 1/0023 (2013.01); H04R 31/006 (2013.01); B81B 7/0032 (2013.01); B81B 2201/0257 (2013.01); H04R 2231/003 (2013.01);
Abstract

A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.


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