The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Apr. 06, 2021
Applicants:

Ajou University Industry-academic Cooperation Foundation, Suwon-si, KR;

Smart Electronics Inc., Ulsan, KR;

Inventors:

Chang-Koo Kim, Seoul, KR;

Hae-Min Lee, Suwon-si, KR;

Doo Won Kang, Anyang-si, KR;

Hyun Chang Kim, Ulsan, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01T 4/12 (2006.01); H01T 21/00 (2006.01); C23C 18/50 (2006.01); C23C 18/18 (2006.01); C23C 18/16 (2006.01); C23C 18/36 (2006.01); H01T 4/02 (2006.01); H01C 1/024 (2006.01); H01C 1/026 (2006.01);
U.S. Cl.
CPC ...
H01T 4/12 (2013.01); C23C 18/1651 (2013.01); C23C 18/1692 (2013.01); C23C 18/1893 (2013.01); C23C 18/36 (2013.01); C23C 18/50 (2013.01); H01T 21/00 (2013.01); H01C 1/024 (2013.01); H01C 1/026 (2013.01); H01T 4/02 (2013.01);
Abstract

A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.


Find Patent Forward Citations

Loading…